محل اتصال سیم دو ردیفه Crimp بدون هالوژن سیم به برد PHB 2.0mm Pitch

خانه محصولات Circuit Board Wire Connectors

محل اتصال سیم دو ردیفه Crimp بدون هالوژن سیم به برد PHB 2.0mm Pitch

Crimp Dual Row Wire Housing Halogen Free PHB Wire To Board Connector 2.0mm Pitch

جزئیات محصول:

Place of Origin:	Dongguan, China(mainland)
نام تجاری:	HRT
گواهی:	ISO9001/ ISO14001/UL/RoHS/REACH
Model Number:	A2008HB-NP

پرداخت:

Minimum Order Quantity:	5000 pcs
قیمت:	negotiated
Packaging Details:	Bag with outside carton
Delivery Time:	5 to 8 working days after payment checked
Payment Terms:	TT, Western Union, PayPal, L/C
Supply Ability:	500 K pcs per month

اکنون تماس بگیرید

توضیحات محصول جزئیات

رنگ:	سفید	گام صدا:	2.00 میلی متر
ترمینال های مناسب:	سری A2008T	ویفر مناسب:	سری A2008W
کلاس اشتعال پذیری:	UL94V-0	شماره ردیف:	دوتایی/دوبل
برجسته:	اتصالات برد مدار چاپی , اتصالات سیم به برد PCB , اتصال سیم به برد PHB

1, The specification details

Basic size information
Material		PA66
Wire range		AWG28# to 22#
Mating lock to part		With
Wire Termination Method		Crimping
Circuits		12 to 40 pins
Wire Insulation Diameter		1.50mm Max.
Mounting side		Standard on-Board
Terminals material		Phosphor bronze; tin-plated finish

Electrical properties
Current Rating		3A AC, DC
Voltage Rating		250V AC, DC
Contact Resistance		20mΩ Max
Insulation Resistance		1000mΩ min
Withstanding Voltage		1000V AC/minute

Mechanical properties
Operating temperature range		-25℃ to 85 ℃

Other information please kindly check the following picture.

2, Related demission drawing & teting report

محل اتصال سیم دو ردیفه Crimp بدون هالوژن سیم به برد PHB 2.0mm Pitch

Testing report

5. Mechanical Performance

Test Description		Procedure	Requirement
5-1	Actuator Insertion & Withdrawal Force	Insert and withdraw connectors at the speed rate of 25±3mm / minute.	Refer to paragraph 7
5-2	Crimping Pull Out Force	Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)	AWG#22	4.0kgf (Min)
			AWG#24	3.0kgf (Min)
			AWG#26	2.0kgf (Min)
			AWG#28	1.0kgf (Min)
5-3	Terminal Insertion Force.	Insert the crimped terminal into the housing.	1.00kgf (Max.)
5-4	Terminal/Housing Retention Force.	Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.	2.0kgf (Min.)
5-5	Pin Retention Force	Apply axial push force at the speed rate of 25±3mm / minute	1.0kgf (Min.)
5-6	Durability	When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.	Contact Resistance 40mΩ (Max.)
5-7	Vibration	Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Discontinuity 1 μsec.(Max.)
5-8	Physical Shock	490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description		Procedure	Requirement
6-1	Temperature Rise	Carrying rated current load.(Based upon UL 498)	30℃(Max.)
6-2	Heat Resistance	85±2℃, 96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-3	Cold Resistance	-25±3℃,96 hours (Based upon JIS C0020)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-4	Humidity	Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Insulation Resistance 1000MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3
6-5	Temperature Cycling	5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-6	Salt Spray	Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7	SO2 Gas	24 hours exposure to 50±5ppm. SO2 gas at 40±2℃.
6-8	NH3 Gas	40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.

6-9

Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes

6-10

Resistance to Soldering Heat

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Actuator Insertion/Withdrawal Force

[Unit : kgf]

Circuits	At Initial		Circuits	At Initial
Circuits	Insertion (Max.)	Withdrawal (Min.)	Circuits	Insertion (Max.)	Withdrawal (Min.)
Single	0.50	0.10	2X11	7.10	1.50
2X02	1.70	0.60	2X12	7.70	1.60
2X03	2.30	0.70	2X13	8.30	1.70
2X04	2.90	0.80	2X14	8.90	1.80
2X05	3.50	0.90	2X15	9.50	1.90
2X06	4.10	1.00	2X16	10.10	2.00
2X07	4.70	1.10	2X17	10.70	2.10
2X08	5.30	1.20	2X18	11.30	2.20
2X09	5.90	1.30	2X19	11.90	2.30
2X10	6.50	1.40	2X20	12.50	2.40

3, Multiple payment & shipping modes
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محل اتصال سیم دو ردیفه Crimp بدون هالوژن سیم به برد PHB 2.0mm Pitch

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